3D IC and 2.5D IC Packaging Market Changing the Industries
Introduction to 3D IC and 2.5D IC Packaging The world of integrated circuit (IC) packaging technology has witnessed significant advancements in recent years, and one of the most groundbreaking developments is the emergence of 3D IC and 2.5D IC packaging. These packaging techniques have revolutionized the way electronic components are stacked and interconnected, unlocking new possibilities for various industries. In this article, we will delve into the basics of 3D IC and 2.5D IC packaging, explore their advantages, applications in different industries, and understand the impact they have on the medical devices sector. Understanding the basics of IC packaging technology Before we dive into the specifics of 3D IC and 2.5D IC packaging, it is essential to grasp the fundamentals of IC packaging technology. IC packaging is the process of enclosing electronic components, such as microchips, in protective casings to ensure their functionality and reliability. Traditional IC packaging i...