Why Flip chip Technology is Getting Popular
In the evolution of the packaging of electronics, the aim is to improve the density of packaging, lower cost, and increase performance. A chip of semiconductor is set up face down into the circuit board is perfect for size considerations as there is no extra space needed for contacting on the sides of the component. And this is done while increasing the reliability of the circuits. The whole process is known as flip-chip technology. In the typical packaging process, the interconnection between the carrier and the die is set up by using a wire. The die is then connected to the carrier, and then a wire is bonded first to the die, then looped and bonded to the carrier. The length of wires is typically 1-5mm. On the other hand, in flip-chip technology , the interconnection between the die and the carrier is set up through a bump which is located on the die surface. The height of the bump is typically 0.06 to 0.1mm. Flip-chip technology: Let’s know it from Scratch Flip-chip is not a rec...